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1N5544DUR Datasheet(PDF) 1 Page - Microsemi Corporation |
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1N5544DUR Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page Low Voltage Surface Mount 500 mW Avalanche Diodes SCOTTSD A L E DIVISION 1N5518BUR thru 1N5546BUR (or MLL5518B thru MLL5546B) DESCRIPTION APPEARANCE The 1N5518BUR thru 1N5546BUR series of 0.5 watt glass surface mount Zener voltage regulators provides a selection from 3.3 to 33 volts in standard 5% tolerances as well as tighter tolerances identified by different suffix letters on the part number. These are also available with an internal- metallurgical-bond option by adding a “-1” suffix (see separate data sheet) including JAN, JANTX, and JANTXV military qualifications. Microsemi also offers numerous other Zener products to meet higher and lower power applications. DO-213AA IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Surface mount equivalent to JEDEC registered 1N 5518 thru 1N5546 series • Internally metallurgical bond option available by adding “-1” suffix that also includes JAN, JANTX, and JANTXV qualifications per MIL-PRF-19500/437 (see separate data sheet for same part numbers with “-1” suffix • DO-7 or DO-35 glass body axial-leaded Zener equivalents also available per JEDEC registration (see separate data sheets for part numbers 1N5518 thru 1N5546 DO-7 and DO-35 • Regulates voltage over a broad operating current and temperature range • Extensive selection from 3.3 to 33 V • Standard voltage tolerances are plus/minus 5% with a “B” suffix, e.g. 1N5518BUR, etc. • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively, e.g. 1N5518CUR, 1N5518DUR, etc. • Hermetically sealed surface mount package • Nonsensitive to ESD per MIL-STD-750 Method 1020 • Minimal capacitance (see Figure 3) • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS MECHANICAL AND PACKAGING • Operating and Storage temperature: -65ºC to +175 ºC • Thermal Resistance: 150 ºC/W junction to end cap and 300 ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page) • Steady-State Power: 0.5 watts at end cap temperature TEC < 100 ºC or ambient temperature TA < 25 ºC when mounted on FR4 PC board as described for thermal resistance above (see Figure 2 for derating) • Forward voltage @200 mA: 1.1 volts (maximum) • Solder Temperatures: 260 ºC for 10 s (max) • CASE: Hermetically sealed glass DO-213AA (SOD80 or MLL34) MELF style package • TERMINALS: End caps tin-lead plated solderable per MIL-STD-750, method 2026 • POLARITY: Cathode indicated by band where diode is to be operated with the banded end positive with respect to the opposite end for Zener regulation • MARKING: cathode band only • TAPE & REEL option: Standard per EIA-481-1-A with 12 mm tape, 2000 per 7 inch reel or 5000 per 13 inch reel (add “TR” suffix to part number) • WEIGHT: 0.04 grams • See package dimensions and recommended pad layout on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2003 10-13-2003 REV A |
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