HX6408

Advanced Information

11

www.honeywell.com

PACKAGE OUTLINE

ORDERING INFORMATION (1)

(1) Orders may be faxed to 763-954-2051. Please contact our Customer Service Representative at 763-954-2888 for further information.

(2) Engineering Device Description: Parameters are tested -55

(3) With the Non-Sleep Mode option, Pin 36 is a no-connect (NC), and is not wirebonded to the chip. With the Sleep Mode, Pin 36 has the

NSL function.

(4) These devices are screened to QML levels but are not QML certified.

For more information about Honeywell’s family of radiation hardened integrated circuit products and services,

Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any

liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of

others.

H

X

6408

S

H

X

Source

H = Honeywell

PROCESS

X = SOI

PACKAGE DESIGNATION

X = 36 Lead FP

K = Known Good Die

- = Bare Die (no package)

PART NUMBER

SCREEN LEVEL

V = QML Class V Equivalent (4)

Q = QML Class Q Equivalent (4)

S = Level S

E = Eng. Model (2)

TOTAL DOSE HARDNESS

R = 1x10

F = 3x10

H = 1x10

N = No Level Guaranteed (2)

N

MODE (3)

N = Non-Sleep Mode

M = Sleep Mode

Honeywell International Inc.

Aerospace Electronics Systems

Defense & Space Electronics Systems

12001 Highway 55

Plymouth, MN 55441

1-800-323-8295

Form #900918

June 2005

©2005 Honeywell International Inc.

COMMON DIMENSIONS

SYM

MIN.

NOM.

MAX.

A

.102

.113

.125

A1

.085

.095

.105

B

.016

.018

.020

C

.004

.006

.008

D

.910

.920

.930

E

.045

.050

.055

E1

.832

.840

.848

L

-----

.450

-----

Q

-----

.104

-----