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EMIF02-SPK01F2 Datasheet(PDF) 6 Page - STMicroelectronics |
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EMIF02-SPK01F2 Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 7 page EMIF02-SPK01F2 6/7 Figure 14: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 ± 0.1 4 ± 0.1 Ø 1.5 ± 0.1 0.73 ± 0.05 xxz yww ST xxz yww ST xxz yww ST E E E In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4: Ordering Information Note: More packing informations are available in the application notes AN1235: ''Flip-Chip: Package description and recommandations for use'' AN1751: "EMI Filters: Recommendations and measurements" Ordering code Marking Package Weight Base qty Delivery mode EMIF02-SPK01F2 FX Flip-Chip 2.1 mg 5000 Tape & reel (7”) Table 5: Revision History Date Revision Description of Changes 14-Oct-2004 1 First issue |
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