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GS8170DW36AGC-350I Datasheet(PDF) 3 Page - GSI Technology

Part No. GS8170DW36AGC-350I
Description  18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM
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Maker  GSI [GSI Technology]
Homepage  http://www.gsitechnology.com
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GS8170DW36/72AC-350/333/300/250
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.04 4/2005
3/32
© 2003, GSI Technology
512K x 36 Common I/O—Top View (Package C)
1
2
3
4
5
6
7
8
9
10
11
A
NC
NC
A
E2
A
ADV
A
E3
A
DQb
DQb
B
NC
NC
Bc
NC
A
W
A
Bb
NC
DQb
DQb
C
NC
NC
NC
Bd
NC
(144M)
E1
NC
NC
Ba
DQb
DQb
D
NC
NC
VSS
NC
NC
MCL
NC
NC
VSS
DQb
DQb
E
NC
DQc
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
NC
DQb
F
DQc
DQc
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
NC
NC
G
DQc
DQc
VDDQ
VDDQ
VDD
EP2
VDD
VDDQ
VDDQ
NC
NC
H
DQc
DQc
VSS
VSS
VSS
EP3
VSS
VSS
VSS
NC
NC
J
DQc
DQc
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
NC
NC
K
CQ2
CQ2
CK
NC
VSS
MCL
VSS
NC
NC
CQ1
CQ1
L
NC
NC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQa
DQa
M
NC
NC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQa
DQa
N
NC
NC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQa
DQa
P
NC
NC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQa
DQa
R
DQd
NC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQa
NC
T
DQd
DQd
VSS
NC
NC
MCL
NC
NC
VSS
NC
NC
U
DQd
DQd
NC
A
NC
(72M)
A
NC
(36M)
A
NC
NC
NC
V
DQd
DQd
A
A
A
A1
A
A
A
NC
NC
W
DQd
DQd
TMS
TDI
A
A0
A
TDO
TCK
NC
NC
• 2002.06
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Note:
Users of CMOS I/O SigmaRAMs may wish to connect “NC, VREF” and the “NC, CK” pins to VREF (i.e., VDDQ/2) to
allow alternate use of future HSTL I/O SigmaRAMs.




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