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H78L12BA Datasheet(PDF) 9 Page - Hi-Sincerity Mocroelectronics |
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H78L12BA Datasheet(HTML) 9 Page - Hi-Sincerity Mocroelectronics |
9 / 10 page HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200403 Issued Date : 2004.03.01 Revised Date : 2004.08.31 Page No. : 9/10 H78LXXAM / BM, H78LXXAA / BA HSMC Product Specification TO-92 Dimension SOT-89 Dimension Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 3 2 1 A B C D E F G H I 3 1 A D B C I α1 E α2 α3 G H 2 F Marking: Pb Free Mark Pb-Free: " . " (Note) Normal: None Control Code Date Code HA 78 L Product Series (05,06,08,09,12) Note: Green label is used for pb-free packing Pin Style: 1.Output 2.Ground 3.Input Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 4.33 4.83 B 4.33 4.83 C 12.70 - D 0.36 0.56 E- *1.27 F 3.36 3.76 G 0.36 0.56 H- *2.54 I- *1.27 α1 - *5 ° α2 - *2 ° α3 - *2 ° *: Typical, Unit: mm 3-Lead TO-92 Plastic Package HSMC Package Code: A DIM Min. Max. A 4.40 4.60 B 4.05 4.25 C 1.50 1.70 D 2.40 2.60 E 0.36 0.51 F*1.50 - G*3.00 - H 1.40 1.60 I 0.35 0.41 *: Typical, Unit: mm Marking: Date Code Control Code H Product Series (05,06,08,09,12) 78 L Pb Free Mark Pb-Free: " . " (Note) Normal: None Note: Green label is used for pb-free packing Pin Style: 1.Output 2.Ground 3.Input Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M |
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