Amplifier, Power, 2W

5.0-8.5 GHz

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.com for additional data sheets and product information.

Rev A

Preliminary Datasheet

8

MAAP-000021-PKG003

RoHS

Compliant

Figure 28. Recommended Bias Configuration.

Note: The exposed pad centered on the package bottom must be connected to RF

and dc ground for proper electrical and thermal operation.

Figure 27. 5x5 mm 20-Lead MLP.

Refer to M/A-COM Application Note Surface Mounting Instructions for PQFN Packages #S2083* for assembly guidelines.

Additional Precaution: All parts must receive a bake-out of 125ºC for 24 hours prior to any solder reflow operation.

*Application Notes can be found by going to the Site Search Page of M/A-COM’s web page (http://www.macom.com/Application%20Notes/

index.htm) and searching for the required Application Note.