July 2005

Rev. 2

W3DG6463V-D2

8

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

PRELIMINARY

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

ORDERING INFORMATION

Part Number

Speed

CAS Latency

Height*

W3DG6463V10D2-x

100MHz

CL=2

30.48 (1.20")

W3DG6463V7D2-x

133MHz

CL=2

30.48 (1.20")

W3DG6463V75D2-x

133MHz

CL=3

30.48 (1.20")

NOTES:

• Consult Factory for availability of RoHS compliant products. (G = RoHS

Compliant)

• Vendor specific part numbers are used to provide memory components source

control. The place holder for this is shown as lower case “x” in the part numbers

above and is to be replaced with the respective vendors code. Consult factory

for qualified sourcing options. (M = Micron, S = Samsung, G = Infineon & consult

factory for others)

• Consult factory for availability of industrial temperature (-40°C to 85°C) option

Part Number

Speed

CAS Latency

Height*

W3DG6363V10D2-x

100MHz

CL=2

30.48 (1.20")

W3DG6363V7D2-x

133MHz

CL=2

30.48 (1.20")

W3DG6363V75D2-x

133MHz

CL=3

30.48 (1.20")

Note: Available with WP (write protect) on pin 81.

*ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)

PACKAGE DIMENSIONS

3.99

(0.157)

(2X)

8.89

(0.350)

6.35

(0.250)

P1

11.43

(0.450)

3.18

(0.125) (2X)

133.48

(5.255 MAX.)

115.57

(4.550)

6.35

(0.250)

54.61

(2.150)

1.27 ± 0.10

(0.050 ± 0.004)

3.99

(0.157 MIN.)

3.81

(0.150)

MAX.

30.48

(1.200)

MAX.

17.78

(0.700)

42.16

(1.660)

36.83

(1.450)