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N74F8966A Datasheet(PDF) 8 Page - NXP Semiconductors |
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N74F8966A Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 11 page Philips Semiconductors FAST Products Product specification 74F8965/74F8966 9-Bit address/data Futurebus transceiver, ADT December 19, 1990 8 DC ELECTRICAL CHARACTERISTICS (Over recommended operating free-air temperature range unless otherwise noted.) SYMBOL PARAMETER TEST LIMITS UNIT CONDITIONS1 MIN TYP2 MAX IOH High–level output current B0 – B8 VCC = MAX, VIL = MAX, VIH = MIN, VOH = 2.1V 100 µA IAMC (74F8966) VCC = MAX, VIL = MAX, VIH = MIN, VOH = 4.5V 100 µA IOFF Power–off output current B0 – B8 VCC = 0.0V, VIL = MAX, VIH = MIN, VOH = 2.1V 100 µA IAMC (74F8966) VCC = 0.0V, VIL = MAX, VIH = MIN, VOH = 4.5V 100 µA VOH High-level output voltage A0 – A84 VCC = MAX, VIL = MAX, VIH = MIN, IOH = –3mA 2.4 VCC V A0 – A84 VCC = MIN, IOL = 24mA 0.50 V VOL Low-level output voltage IAMC (74F8966) VIL = MAX IOL = 48mA 0.50 V B0 – B8 VIH = MIN IOL = 100mA 0.75 1.0 1.10 V VIK Input clamp voltage VCC = MIN, II = IIK -1.2 V II Input current at maximum input voltage OEB0, OEB1, OEA, LE, LS, IAREQ VCC = MAX, VI = 7.0V 100 µA A0 – A8, B0 – B8 VCC = MAX, VI = 5.5V 1 mA IIH High–level input current OEB0, OEB1, OEA, LE, LS, IAREQ VCC = MAX, VI = 2.7V 20 µA B0 – B8 VCC = MAX, VI = 2.1V 100 µA IIL Low–level input current OEB0, OEB1, OEA, LE, LS, IAREQ VCC = MAX, VI = 0.5V –100 µA B0 – B8 VCC = MAX, VI = 0.3V –100 µA IIH + IOZH Off–state output current, high–level voltage applied A0 – A8 VCC = MAX, VO = 2.7V 50 µA IIL + IOZL Off–state output current, low–level voltage applied VCC = MAX, VI = 0.5V –50 µA IOS Short circuit output current3 A0 – A8 only AO8 VCC = MAX -60 -150 mA ICCH VCC = MAX 80 140 mA ICC Supply current (total) ICCL VCC = MAX, VIL = 0.5V 85 145 mA ICCZ 75 100 mA Notes to DC electrical characteristics 1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at VCC = 5V, Tamb = 25°C. 3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold tech- niques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last. 4. Due to test equipment limitations, actual test conditions are for VIH =1.8V and VIL = 1.3V. |
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