Tape and Reel Specifications

◎Embossed Taping

Tape in accordance can be supplied to IEC publication 286-3

DIMENSIONS (mm)

Symbol

Type

±0.1

±0.1

W

±0.3

F

±0.1

E

±0.1

±0.1

±0.1

±0.1

＋0.1

－0

T

Max.

Max.

Min.

08CH

5.5

8.5

16

7.5

1.75

8.0

2.0

4.0

1.5

1.0

3.0

1.5

Precautions to the user for CH-series Surface mount MOV:

1. Soldering recommendation:

Material: 62/36/2 Sn/Pb/Ag or equivalent

Reflow temperature/time: 230℃ max. /10 sec. max.

Flux: non-activated

2. When mounting surface mount varistor on the PC board, the improper soldering temperature and time

out of the limits may reduce the adhesive strength of their terminals.

3. Put the proper volume of solder（the height of fillet）on PC board for installing surface mount

varistors, because it directly affects the installed varistors. The design of copper pad patterns and

dimensions should be set, so that the proper volume of solder can provide.

4. Do not use solvents such as thinner and acetone, which dissolve or make the exterior covering of

varistor deteriorate. Ultrasonic cleaning shall be so set that the vibration can not travel the assembly

boards.

5. For surface mount CH series MOV, use flux with a halogen content of less than 0.2 wt. Do not use

strong acid flux.

6. Store varistors at temperature of –10 to +40℃ and relative humidity of less than 75﹪. Avoid storing

in environment of rapid changes in temperature, direct sunlight, corrosive, gas or dust, and store with

the varistors packaged.

E

W

F

Top Tape

Direction of unreeling

T

JV 08CH SMD

DB LECTRO Inc. 3600 boul. Matte suite i Brossard Qc J4Y-2Z2 tel:(450)-444-1424 fax:(450)-444-4714 www.dblectro.com