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W7G1M32SVX-BN Datasheet(PDF) 1 Page - White Electronic Designs Corporation

Part # W7G1M32SVX-BN
Description  8MB/4MB (2x1Mx32 / 1Mx32) CMOS, Boot Sector Flash Memory Module
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Manufacturer  WEDC [White Electronic Designs Corporation]
Direct Link  http://www.whiteedc.com
Logo WEDC - White Electronic Designs Corporation

W7G1M32SVX-BN Datasheet(HTML) 1 Page - White Electronic Designs Corporation

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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W7G1M32SVx-BN
W7G21M32SVx-BN
Feb. 2004
Rev. 2
PRELIMINARY*
DESCRIPTION
The W7G1M32SVx-BN and W7G21M32SVx-BN are
organized as one and two banks of 1Mx32 respectively.
The modules are based on AMDs AM29LV160DT - 1Mx16
or STs M29W160ET (optional) Flash device in TSOP
packages which are mounted on an FR4 substrate.
Both modules offer access times between 70 and 120ns
allowing for operation of high-speed microprocessors
without wait states.
FEATURES
1Mx32 and 2x1Mx32 Densities
Based on AMD – AM29LV160DT Flash Device
STs M29W160ET (optional)
Fast Read Access Time – 70ns
3.3V Only Reprogramming
Flexible, Sector Architecture
• One 16Kbyte, two 8Kbyte, one 32Kbyte and
thirty-one 64Kbyte sectors.
• Any combination of sectors can be erased
• Also supports full chip erase
Top boot block configurations
• Bottom boot block optional. Contact WEDC.
W7G1M32SVx-BN: 1Mx32 80 PIN SIMM
W7G21M32SVx-BN: 2x1Mx32 80 PIN SIMM
8MB/4MB (2x1Mx32 / 1Mx32) CMOS, Boot Sector Flash
Memory Module
FIG. 1 – BLOCK DIAGRAMS
DQ16-31
1Mx16
WE#
CE#
CE#
Addr
0-19
DQ0-15
WE2#
DQ0-15
1Mx16
WE#
CE#
CE0#
OE#
CE#
Addr
0-19
Addr 0-19
DQ0-15
WE0#
1Mx16
WE#
CE#
CE#
Addr
0-19
DQ0-15
WE2#
1Mx16
WE#
CE#
CE0#
OE#
CE#
Addr
0-19
Addr 0-19
DQ0-15
WE0#
DQ16-31
1Mx16
WE#
CE#
CE#
Addr
0-19
DQ0-15
DQ0-15
1Mx16
WE#
CE#
CE1#
CE#
Addr
0-19
DQ0-15
Embedded Erase Algorithms
• Automatically preprograms and erases the chip
or any combination of sectors
Embedded Program Algorithms
• Automatically programs and verifies data at
specified address
Data Polling and Toggle Bit feature for detection of
program or erase cycle completion
Low Power Dissipation
• 30mA per Device Active Current
• 10µA per Device CMOS Standby Current
Single 3.3V ±10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and industrial operating temperature
range
• BNC = 0°C to 70°C Commercial
• BNI = -40°C to 85°C Industrial
Package
• 80 Pin SIMM (JEDEC) Standard
* This product is under development, is not qualified or characterized and is subject to
change without notice.


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