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W332M72V-125SBI Datasheet(PDF) 9 Page - White Electronic Designs Corporation |
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W332M72V-125SBI Datasheet(HTML) 9 Page - White Electronic Designs Corporation |
9 / 15 page 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W332M72V-XSBX Ju;y 2006 Rev. 3 ABSOLUTE MAXIMUM RATINGS Parameter Unit Voltage on VCC, VCCQ Supply relative to Vss -1 to 4.6 V Voltage on NC or I/O pins relative to Vss -1 to 4.6 V Operating Temperature TA (Mil) -55 to +125 °C Operating Temperature TA (Ind) -40 to +85 °C Storage Temperature, Plastic -55 to +125 °C NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. CAPACITANCE (NOTE 2) Parameter Symbol Max Unit Input Capacitance: CLK CI1 7 pF Addresses, BA0-1 Input Capacitance CA 24 pF Input Capacitance: All other input-only pins CI2 9 pF Input/Output Capacitance: I/Os CIO 9 pF BGA THERMAL RESISTANCE Description Symbol Typical Unit Notes Junction to Ambient (No Airflow) Theta JA 17.0 C/W 1 Junction to Ball Theta JB 16.6 C/W 1 Junction to Case (Top) Theta JC 7.4 C/W 1 NOTE: Refer to Application Note “PBGA Thermal Resistance Correlation” at www.wedc.com in the application notes section for modeling conditions. specified for the clock pin) prior to CKE going back HIGH. Once CKE is HIGH, the SDRAM must have NOP commands issued (a minimum of two clocks) for tXSR, because time is required for the completion of any internal refresh in progress. Upon exiting the self refresh mode, AUTO REFRESH commands must be issued as both SELF REFRESH and AUTO REFRESH utilize the row refresh counter. |
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