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WS1M32V-17G3M Datasheet(PDF) 1 Page - White Electronic Designs Corporation |
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WS1M32V-17G3M Datasheet(HTML) 1 Page - White Electronic Designs Corporation |
1 / 6 page WS1M32V-XG3X 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs White Electronic Designs Corp. reserves the right to change products or specifications without notice. February, 2001 Rev. 5 PRELIMINARY* 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 9 VCC A0 A1 A2 A3 A4 A5 A6 OE#1 OE#2 OE#3 OE#4 NC A7 A8 A9 A10 A11 A12 A13 GND GND NC NC NC NC NC NC NC NC WE#4 WE#3 WE#2 WE#1 NC NC A18 A17 A16 A15 A14 VCC 8 7 6 5 4 3 1 848382 81 80797877 2 37 38 39 40 41 42 43 45 46 47 48 49 50 51 52 53 44 76 75 11 10 33 34 35 36 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 84 lead, 28mm CQFP, (Package 511) Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Commercial, Industrial and Military Temperature Ranges TTL Compatible Inputs and Outputs PIN CONFIGURATION FOR WS1M32V-XG3X PIN DESCRIPTION I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE#1-4 Write Enables CS#1-2 Chip Selects OE#1-4 Output Enables VCC +3.3V Power Supply GND Ground NC Not Connected TOP VIEW 3.3V Power Supply Low Power CMOS Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight - WS1M32V-XG3X - 20 grams typical *This product is under development, is not qualified or characterized and is subject to change without notice. BLOCK DIAGRAM 8 I/O0-7 CS#1 I/O8-15 CS#2 I/O16-23 I/O24-31 A0-18 WE#1 8 2M x 8 8 512K x 8 8 512K x 8 2M x 8 512K x 8 512K x 8 2M x 8 512K x 8 512K x 8 2M x 8 512K x 8 512K x 8 OE#1 WE#2 OE#2 WE#3 OE#3 WE#4 OE#4 Note: CS#1& CS#2 are used as bank select The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form. 1.146" |
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