White Electronic Designs

10

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

July 2005

Rev. 0

ADVANCED

WV3EG32M64ETSU-D3

1.27 (0.050)

4.00

(0.158 (2x))

17.80

(0.70)

133.35 ±0.15

(5.25 ±0.006)

128.95

(5.077")

10.00

(0.393)

64.77

(2.550)

49.53

(1.95)

1.80

(0.071)

2.175

(0.085)

28.58 ±0.15

(1.125 ±0.006)

2.30

(0.10)

(2x)

3.00

(0.118)

(4x)

3.30

(0.130)

MAX

1.27 ±0.10

(0.050 ±0.004)

PACKAGE DIMENSIONS FOR D3

* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)

ORDERING INFORMATION FOR D3

Part Number

Speed

CAS Latency

Height*

Temperature

WV3EG32M64ETSU335D3xG

166MHz/333Mb/s

2.5

3

3

28.58 (1.125")

0°C to 70°C

NOTES:

• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)

• Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to be

replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others)

• Consult factory for availability of industrial temperature (-40°C to 85°C) option