10

Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.

Figure 10. Recommended Pb-Free Reflow Soldering Profile.

1.00

0

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70

-50

-30

0

20 305070

90

-90

-20

-80

-60

-40

-10

10

40

60

80

Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.

100

0

ANGLE

80

60

50

70

20

10

30

40

90

-70

-50

-30

0

20 305070

90

-90

-20

-80

-60

-40

-10

10

40

60

80

Figure 11. Recommended Soldering

Pattern for HSMx-C150.

1.5 (0.059)

1.5

(0.059)

1.5

(0.059)

2.0

(0.079)

Figure 13. Recommended Soldering

Pattern for HSMx-C190, C191 and C197.

0.8 (0.031)

0.8

(0.031)

0.7

(0.028)

0.8

(0.031)

Figure 12. Recommended Soldering

Pattern for HSMx-C170 and C177.

1.2 (0.047)

1.2

(0.047)

0.9

(0.035)

1.2

(0.047)

230°C MAX.

10 SEC. MAX.

4°C/SEC.

MAX.

OVER 2 MIN.

TIME

4°C/SEC. MAX.

140-160°C

3°C/SEC. MAX.

Figure 9. Recommended Reflow Soldering Profile.

217 °C

MAX. 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

100 - 150 °C

255 °C (+5/-0)

60 to 150 SEC.

10 to 20 SEC.

TIME

* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.