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HMPP-386X Datasheet(PDF) 1 Page - Agilent(Hewlett-Packard)

Part # HMPP-386X
Description  MiniPak Surface Mount RF PIN Diodes
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HMPP-386X Datasheet(HTML) 1 Page - Agilent(Hewlett-Packard)

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Agilent HMPP-386x Series
MiniPak Surface Mount
RF PIN Diodes
Data Sheet
Description/Applications
These ultra-miniature products
represent the blending of Agilent
Technologies’ proven semiconduc-
tor and the latest in leadless
packaging technology.
The HMPP-386x series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low capacitance with no
reverse bias is the driving issue for
the designer.
Features
• Surface mount MiniPak package
– low height, 0.7 mm (0.028") max.
– small footprint, 1.75 mm2
(0.0028 inch2)
• Better thermal conductivity for
higher power dissipation
• Single and dual versions
• Matched diodes for consistent
performance
• Low capacitance at zero volts
• Low resistance
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
* For more information, see the Surface
Mount Schottky Reliability Data Sheet.
Pin Connections and
Package Marking
3
2
Product code
Date code
4
AA
1
Package Lead Code Identification
(Top View)
Single
3
2
4
1
#0
Anti-parallel
3
2
4
1
#2
Parallel
3
2
4
1
#5
The low dielectric relaxation
frequency of the HMPP-386x
insures that low capacitance can
be reached at zero volts reverse
bias at frequencies above 1 GHz,
making this PIN diode ideal for
hand held applications.
Low junction capacitance of the
PIN diode chip, combined with
ultra low package parasitics, mean
that these products may be used
at frequencies which are higher
than the upper limit for conven-
tional PIN diodes.
Note that Agilent’s manufacturing
techniques assure that dice
packaged in pairs are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
Notes:
1. Package marking provides orientation and
identification.
2. See “Electrical Specifications” for
appropriate package marking.


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