1998 Mar 26

10

Philips Semiconductors

Product specification

Silicon temperature sensors

KTY81-1 series

PACKAGING

Sensors in SOD70 encapsulation are delivered in bulk packaging and also in reel packaging for automatic placement on

hybrid circuits and printed-circuit boards (see Fig.7).

Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres, whereas the distance for types packaged

on reel is 5.08 millimetres.

Fig.7 Configuration of bandolier.

handbook, full pagewidth

MBH795

(p)

A 1

P

H 2

A

L

H0

H1

F

F12

F

P2

P0

D0

W2

W0 W

1

W

t

t1

∆ h

∆ h

T