PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

UCC2809D-1

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809D-2

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809DTR-1

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809DTR-2

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809P-1

ACTIVE

MSOP

DGK

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809P-2

ACTIVE

MSOP

DGK

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809PTR-1

ACTIVE

MSOP

DGK

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809PTR-1G4

PREVIEW

MSOP

DGK

8

2500

None

Call TI

Call TI

UCC2809PTR-2

ACTIVE

MSOP

DGK

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2809PW-1

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC2809PW-2

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC2809PWTR-1

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC2809PWTR-2

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3809D-1

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809D-2

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809DTR-1

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809DTR-2

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809N-1

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

UCC3809N-2

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

UCC3809P-1

ACTIVE

MSOP

DGK

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809P-2

ACTIVE

MSOP

DGK

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809PTR-1

ACTIVE

MSOP

DGK

8

2000

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3809PW-1

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3809PW-2

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3809PWTR-1

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

PACKAGE OPTION ADDENDUM

www.ti.com

4-Mar-2005

Addendum-Page 1