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VSM1206

Vishay Foil Resistors

Document Number: 63090

Revision 21-May-03

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MODEL

CHIP SIZE

RESISTANCE VALUE

TOLERANCE

TERMINATION

PACKAGING

VSM

1206

RESISTANCE

LETTER

MULTIPLIER

T ± 0.01%

B = Solderable

T = Tape and

RANGE

DESIGNATOR

FACTOR

Q ± 0.02%

Reel

A ± 0.05%

W = Waffle

10Ω to < 1KΩ

Rx 1.0

B ± 0.1%

Pack

Example: 249R00 = 249Ω

C ± 0.25%

D ± 0.5%

1K to 30K

K

x 10

3

F ± 1.0%

Example: 10K000 = 10.0KΩ

TABLE 4 - ORDERING INFORMATION

D

T

W

L

Footprint

G

Z

X

Uncoated

Ceramic

TABLE 3 - DIMENSIONS AND LAND PATTERN in inches (millimeters)

Bulk Metal

Discrete High Precision Surface Mount Chip Resistor

*Land Pattern Dimensions are per IPC-782

Bottom View for Mounting

Recommended Land Pattern

LWT

D

Z*

G*

X*

MAXIMUM

MAXIMUM

MINIMUM

MAXIMUM

0.126

0.062

0.025

0.020

0.175

0.059

0.071

[3.2]

[1.57]

[0.64]

[0.50]

[4.4]

[1.5]

[1.806]

*As shown + 0.01 Ohms to allow for measurement errors at low values.

FIGURE 2 - DERATING CURVE

125

100

75

50

25

0

-75

–50

–25

0

+25

+50

+75

+100 +125 +150 +175

Ambient Temperature (°C)

–55°C

+70°C

Rated Power

25% to 85% of T

FIGURE 3 - RECOMMENDED MOUNTING

A low profile solder fillet is

recommended to avoid unnecessary

stresses along top edge of

metallization. IR and vapor phase

reflow are best. Avoid the use of

cleaning agents which could attack

epoxy resins, which form part of the

resistor construction.

TEST

MIL-PRF-55342G

VSM1206

CHARACTERISTIC E

MAXIMUM

Thermal Shock

± 0.10%

± 0.02%

Low Temperature Operation

± 0.10%

± 0.02%

Short Time Overload

± 0.10%

± 0.02%

High Temperature Exposure

± 0.10%

± 0.03%

Resistance to Bonding

± 0.20%

± 0.01%

Moisture Resistance

± 0.20%

± 0.03%

Life 2000 hours @ + 70

± 0.50%

± 0.01%

TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS