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MC74LVX50DR2G Datasheet(PDF) 5 Page - ON Semiconductor

Part # MC74LVX50DR2G
Description  HEX BUFFER
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC74LVX50DR2G Datasheet(HTML) 5 Page - ON Semiconductor

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MC74LVX50
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5
Figure 3. Switching Waveforms
VCC
GND
50%
50% VCC
A
Y
tPHL
tPLH
*Includes all probe and jig capacitance
Figure 4. Test Circuit
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 5. Input Equivalent Circuit
INPUT
EMBOSSED CARRIER DIMENSIONS (See Notes 9 and 10)
Tape
Size
B1
Max
D
D1
E
F
K
P
P0
P2
R
T
W
8 mm
4.35 mm
(0.179”)
1.5 mm
+ 0.1
−0.0
(0.059”
0 004
1.0 mm
Min
(0.179”)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
2.4 mm
Max
(0.094”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12 mm
8.2 mm
(0.323”)
(
+0.004
−0.0)
1.5 mm
Min
(0.060)
)
5.5 mm
±0.5
(0.217
±0.002”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
)
)
30 mm
(1.18”)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm
12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm
20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
9. Metric Dimensions Govern−English are in parentheses for reference only.
10. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10
° within the determined cavity


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