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P83C750EBDDB Datasheet(PDF) 2 Page - NXP Semiconductors |
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P83C750EBDDB Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 16 page Philips Semiconductors Product specification 83C750/87C750 80C51 8-bit microcontroller family 1K/64 OTP/ROM, low pin count 2 1998 May 01 853–1683 19331 DESCRIPTION The Philips 8XC750 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC750 Microcontroller is fabricated with Philips high-density CMOS technology. Philips epitaxial substrate minimizes CMOS latch-up sensitivity. The 87C750 contains a 1k × 8 EPROM, a 64 × 8 RAM, 19 I/O lines, a 16-bit auto-reload counter/timer, a five-source, fixed-priority level interrupt structure and an on-chip oscillator. FEATURES • 80C51 based architecture • Oscillator frequency range—up to 16MHz • Small package sizes – 24-pin DIP (300 mil “skinny DIP”) – 24-pin Shrink Small Outline Package – 28-pin PLCC • 87C750 available in one-time programmable plastic packages • Low power consumption: – Normal operation: less than 11mA @ 5V, 12MHz – Idle mode – Power-down mode • 1k × 8 EPROM (87C750) • 64 × 8 RAM • 16-bit auto reloadable counter/timer • Boolean processor • CMOS and TTL compatible • Well suited for logic replacement, consumer and industrial applications • LED drive outputs PIN CONFIGURATIONS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 P3.4/A4 P3.3/A3 P3.2/A2/A10 P3.1/A1/A9 P3.0/A0/A8 P0.2/VPP RST X2 X1 VSS P0.0/ASEL P1.0/D0 P1.1/D1 P1.2/D2 P1.3/D3 P1.4/D4 P1.5/INT0/D5 P1.6/INT1/D6 P1.7/T0/D7 P3.7/A7 P3.6/A6 P3.5/A5 VCC PLASTIC DUAL IN-LINE AND SHRINK SMALL OUTLINE PACKAGE PLASTIC LEADED CHIP CARRIER 41 26 5 11 25 19 12 18 P0.1/OE–PGM Pin Function 1 P3.4/A4 2 P3.3/A3 3 P3.2/A2/A10 4 P3.1/A1/A9 5 NC* 6 P3.0/A0/A8 7 P0.2/VPP 8 P0.1/OE-PGM 9 P0.0/ASEL 10 NC* 11 RST 12 X2 13 X1 14 VSS Pin Function 15 P1.0/D0 16 P1.1/D1 17 P1.2/D2 18 P1.3/D3 19 P1.4/D4 20 P1.5/INT0/D5 21 NC* 22 NC* 23 P1.6/INT1/D6 24 P1.7/T0/D7 25 P3.7/A7 26 P3.6/A6 27 P3.5/A5 28 VCC SU00295A * NO INTERNAL CONNECTION ORDERING INFORMATION ROM EPROM1 TEMPERATURE RANGE °C AND PACKAGE FREQUENCY DRAWING NUMBER P83C750EBP N P87C750EBP N OTP 0 to +70, Plastic Dual In-line Package 3.5 to 16MHz SOT222-1 P83C750EFP N P87C750EFP N OTP –40 to +85, Plastic Dual In-line Package 3.5 to 16MHz SOT222-1 P83C750EBA A P87C750EBA A OTP 0 to +70, Plastic Lead Chip Carrier 3.5 to 16MHz SOT261-3 P83C750EFA A P87C750EFA A OTP –40 to +85, Plastic Lead Chip Carrier 3.5 to 16MHz SOT261-3 P83C750EBD DB P87C750EBD DB OTP 0 to +70, Shrink Small Outline Package 3.5 to 16MHz SOT340-1 NOTE: 1. OTP = One Time Programmable EPROM. |
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