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HP3-000-U Datasheet(PDF) 1 Page - CTS Corporation |
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HP3-000-U Datasheet(HTML) 1 Page - CTS Corporation |
1 / 6 page Series HP3 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP3 Series for Single TO-3 or Stud Mount DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information CTS IERC PART NO. Unplated Comm'l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. ref. no. Max. Weight (Grams) HP3-000-U HP3-T03-U HP3-T03-33U HP3-000-CB HP3-T03-CB HP3-T03-33CB HP3-000-B HP3-T03-B HP3-T03-33B Undrilled T0-3 T0-3 IC -- 16 17 55.0 55.0 55.0 |
Similar Part No. - HP3-000-U |
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Similar Description - HP3-000-U |
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