Series HP3

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP3 Series for Single TO-3 or Stud Mount

DESCRIPTION OF CURVES

A.

B.

C.

D.

E.

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

•

Thermal Resistance Case to Sink is 0.1-0.3

°C/W w/Joint Compound.

•

Derate 1.0

°C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Unplated

Comm'l. Black

Anodize

Mil. Black Anodize

Semiconductor

Accommodated

Hole patt. ref.

no.

Max. Weight

(Grams)

HP3-000-U

HP3-T03-U

HP3-T03-33U

HP3-000-CB

HP3-T03-CB

HP3-T03-33CB

HP3-000-B

HP3-T03-B

HP3-T03-33B

Undrilled

T0-3

T0-3 IC

--

16

17

55.0

55.0

55.0