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HP1-TO15-CB Datasheet(PDF) 6 Page - CTS Corporation |
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HP1-TO15-CB Datasheet(HTML) 6 Page - CTS Corporation |
6 / 7 page 23. Hole pattern no. 3 accommodates TO-15s, DO-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 24. Hole pattern no. 114 accommodates TO-66s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 25. Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 26. Hole pattern no. 226 accommodates TO-66 ICs (socket). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 31. Hole pattern no. 213 accommodates one TO-3 (panel mounted). Available in HP1 and HP3 series heat dissipators only. 32. Hole pattern no. 150 accommodates two TO-66s. Available in HP1 and HP3 series heat dissipators only. |
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