© 2006 CTS Corporation. All rights reserved. Information subject to change.

CTS Electronic Components

Page 2

March 06

www.ctscorp.com

GTL, GTL+, AGTL+ Terminator

Recommended Land Pattern

1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)

1.27mm pitch (B6) = 0.64mm/.025 inch (minimum)

Outline of Substrate

PCB Pad Diameter

For .006" Thick Solder Paste Stencil, Aperture Opening Should

be Equal to the PCB Pad Diameter.

additional PCB design information

Solder Mask Dia = Pad

Diameter +.15mm (.006 inch)

A

C

B

H

1nS

250mV

Aggressor

D

E

F

I

Aggressor on

Lead A

250mV 1nS

Rise Time

Measured

Voltage

(Peak to Peak)

Victim B

3.3 mV

Victim C

1.9 mV

Victim D

1.5 mV

Victim E

1.5 mV

Victim F

1.5 mV

Victim H

2.1 mV

Victim I

3.3 mV

Aggressor on

Lead B

250mV 1nS

Rise Time

Measured

Voltage

(Peak to Peak)

Victim A

3.2 mV

Victim C

2.7 mV

Victim D

1.8 mV

Victim E

1.4 mV

Victim F

1.5 mV

Victim H

1.5 mV

Victim I

2.0 mV

Routing Examples

16 Bit , 3 x 6 Array

(10X)

Signal

Lines

8 Bit , 3 x 3 Array

(10X)

Signal

Lines

Blind via to Vtt

reference plane layer.

Open via’s on top of

land pads are not

recommended due to

solder wicking.

1.27 mm pitch land

patterns are shown.

32 Bit , 3 x 12 Array

(5X)

5 mil line widths shown.

0

10

20

30

40

50

60

70

80

90

100

F requency R esponse for 50 ohm Netw ork

MHz