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HP1-TO66-4B Datasheet(PDF) 2 Page - CTS Corporation |
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HP1-TO66-4B Datasheet(HTML) 2 Page - CTS Corporation |
2 / 7 page HP1 Series for Single TO-66 Outline DESCRIPTION OF CURVES B. N.C. Horiz. Device Only Mounted to G-10. D. N.C. Horiz. & Vert. With Dissipator. E. 200 RPM w/Diss. F. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-28) Max. Weight (Grams) HP1-TO66-U HP1-TO66-35U HP1-TO66-49U HP1-TO66-CB HP1-TO66-35CB HP1-TO66-49CB HP1-TO66-B HP1-TO66-35B HP1-TO66-49B TO-66 TO-66 IC TO-66 IC (Socket) 24 25 26 35.0 35.0 35.0 |
Similar Part No. - HP1-TO66-4B |
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Similar Description - HP1-TO66-4B |
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