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HP1-TO66-8U Datasheet(PDF) 1 Page - CTS Corporation |
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HP1-TO66-8U Datasheet(HTML) 1 Page - CTS Corporation |
1 / 7 page Series HP1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP1 Series for Single TO-3 or Stud Mount Devices DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. A. N.C. Horiz. & Vert. With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-28) Max. Weight (Grams) HP1-000-U HP1-TO3-U HP1-TO3-33U HP1-TO3-44U HP1-436-U HP1-TO6-U HP1-TO15-U HP1-420-U HP1-000-CB HP1-TO3-CB HP1-TO3-33CB HP1-TO3-44CB HP1-436-CB HP1-T06-CB HP1-TO15-CB HP1-420-CB HP1-000-B HP1-TO3-B HP1-TO3-33B HP1-TO3-44B HP1-436-B HP1-T06-B HP1-TO15-B HP1-420-B Undrilled TO-3 TO-3 IC TO-3 panel mount TO-3 (4-pin) TO-6, TO-36 TO-15, DO-5 Universal -- 16 17 31 18 19 23 27 35.0 35.0 35.0 35.0 35.0 35.0 35.0 35.0 |
Similar Part No. - HP1-TO66-8U |
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Similar Description - HP1-TO66-8U |
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