ChipGuard

Specifications are subject to change without notice.

Customers should verify device performance in their specific applications.

Product Dimensions

DIMENSIONS =

MM

(INCHES)

L

W

B

A

Recommended Pad Layout

A

C

B

D

• This product can be damaged by rapid heating, cooling or localized heating.

• Heat shocks should be avoided. Preheating and gradual cooling recommended.

• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.

• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under

30 watts is recommended.

Solder Reflow Recommendations

110 sec. (min.)

300

250

200

150

100

50

0

30-70

sec.

120 sec. (min.)

Preheat Stages 1-3

Soldering

Cooling

Time (seconds)

Dimension

CG0402MLA

CG0603MLA

Series

Series

L

1.00 ± 0.15

1.60 ± 0.20

(0.04 ± 0.006)

(0.064 ± 0.008)

W

0.50 ± 0.10

0.80 ± 0.20

(0.02 ± 0.004)

(0.032 ± 0.008)

A

0.50 ± 0.10

0.80 ± 0.20

(0.02 ± 0.004)

(0.032 ± 0.008)

B

0.25 ± 0.15

0.30 ± 0.20

(0.010 ± 0.006)

(0.012 ± 0.008)

Dim.

CG0402MLA

CG0603MLA

Series

Series

A

0.51

0.76

(0.020)

(0.030)

B

0.61

1.02

(0.024)

(0.040)

C

0.51

0.50

(0.020)

(0.020)

D

1.70

2.54

(0.067)

(0.100)

A

Stage 1 Preheat Ambient to Preheating

30 s to 60 s

Temperature

B

Stage 2 Preheat 140 °C to 160 °C

60 s to 120 s

C

Stage 3 Preheat Preheat to 200 °C

20 s to 40 s

D

Main Heating

200 °C

60 s to 70 s

210 °C

55 s to 65 s

220 °C

50 s to 60 s

230 °C

40 s to 50 s

240 °C

30 s to 40 s

E

Cooling

200 °C to 100 °C

1 °C/s to 4 °C/s