JULY 2000 - REVISED FEBRUARY 2005

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

TISP4xx0L3LM Overvoltage Protector Series

LM002 (DO-92) 2-Pin Cylindrical Plastic Package

MECHANICAL DATA

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will

withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high

humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

LM002 Package (DO-92)

MD4XARB

1

3

2

A

3

1

2

VIEW A

DIMENSIONS ARE: MILLIMETERS

(INCHES)

4.44 - 5.21

(.175 - .205)

3.43

(.135)

4.32 - 5.34

(.170 - .210)

3.17 - 4.19

(.125 - .165)

2.03 - 2.67

(.080 - .105)

0.40 - 0.56

(.016 - .022)

0.35 - 0.41

(.014 - .016)

MIN.

2.20

(.086)

MAX.

12.7

(0.50)

MIN.

1.14 - 1.40

(.045 - .055)

2.41 - 2.67

(.095 - .105)

2.03 - 2.67

(.080 - .105)

“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.

“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.