Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Surface Mount Chip Inductor Capability Matrix

REV. 05/05

MA Series Chip Ferrite Bead Arrays

DIMENSIONS ARE:

MM

(INCHES)

Product Dimensions

Recommended Land Pattern

3.2 ± 0.2

(.126 ± .008)

0.4 ± 0.15

(.016 ± .006)

0.2 ± 0.1

(.008 ± .004)

0.8 ± 0.1

(.031 ± .004)

0.8 ± 0.1

(.031 ± .004)

0.2 MIN. TO 0.45 MAX.

(.008 MIN. TO .018 MAX.)

1.6 ± 0.2

(.063 ± .008)

0.8

(.031)

0.4

(.016)

0.8

(.031)

2.5

(.098)

Reel Dimensions

2.0 ± 0.5

(.079 ± .020)

50.0

(1.969)

178.0

(7.00)

DIA.

12.5

(.492)

9.0

(.354)

13.0 ± 0.5

(.512 ± .020)

DIA.

13.0 ± 0.5

(.512 ± .020)

DIA.

21.0 ± 0.8

(.827 ± .031)

EMBOSSED

CARRIER

CARRIER TAPE WIDTH:

CAVITY PITCH:

EMBOSSED

CAVITY

0.10

(.004)

THICKNESS

MAX.

8.0

(.315)

4.0

(.157)

8.0

(.315)

3000 pcs. per reel.

Gross weight: 140g.

Recommended Soldering

Preheating:

100 to 150°C

2 minutes min.

10 seconds max.

Soldering 230°C

30 seconds max.

200°C