Electronic Components Datasheet Search |
|
MF-MSMD200 Datasheet(PDF) 2 Page - Bourns Electronic Solutions |
|
MF-MSMD200 Datasheet(HTML) 2 Page - Bourns Electronic Solutions |
2 / 4 page Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. A B C Top and Bottom View Side View D Product Dimensions Packaging: 2000 pcs. per reel. MF-MSMD Series - PTC Resettable Fuses AB C D Model Min. Max. Min. Max. Min. Max. Min. MF-MSMD010 4.37 4.73 3.07 3.41 0.56 0.81 0.30 (0.172) (0.186) (0.121) (0.134) (0.022) (0.032) (0.012) MF-MSMD014 4.37 4.73 3.07 3.41 0.56 0.81 0.30 (0.172) (0.186) (0.121) (0.134) (0.022) (0.032) (0.012) MF-MSMD020 4.37 4.73 3.07 3.41 0.56 0.81 0.30 (0.172) (0.186) (0.121) (0.134) (0.022) (0.032) (0.012) MF-MSMD030 4.37 4.73 3.07 3.41 0.56 0.81 0.30 (0.172) (0.186) (0.121) (0.134) (0.022) (0.032) (0.012) MF-MSMD050 4.37 4.73 3.07 3.41 0.38 0.62 0.30 (0.172) (0.186) (0.121) (0.134) (0.015) (0.024) (0.012) MF-MSMD075 4.37 4.73 3.07 3.41 0.38 0.62 0.30 (0.172) (0.186) (0.121) (0.134) (0.015) (0.024) (0.012) MF-MSMD110 4.37 4.73 3.07 3.41 0.38 0.62 0.30 (0.172) (0.186) (0.121) (0.134) (0.015) (0.024) (0.012) MF-MSMD125 4.37 4.73 3.07 3.41 0.30 0.48 0.30 (0.172) (0.186) (0.121) (0.134) (0.012) (0.019) (0.012) MF-MSMD150 4.37 4.73 3.07 3.41 0.30 0.48 0.30 (0.172) (0.186) (0.121) (0.134) (0.012) (0.019) (0.012) MF-MSMD160 4.37 4.73 3.07 3.41 0.30 0.48 0.30 (0.172) (0.186) (0.121) (0.134) (0.012) (0.019) (0.012) MF-MSMD200 4.37 4.73 3.07 3.41 0.30 0.48 0.30 (0.172) (0.186) (0.121) (0.134) (0.012) (0.019) (0.012) MF-MSMD260 4.37 4.73 3.07 3.41 0.25 0.48 0.30 (0.172) (0.186) (0.121) (0.134) (0.010) (0.019) (0.012) 160–220 300 250 200 150 100 50 0 10–20 120 Preheating Soldering Cooling Time (seconds) Solder Reflow Recommendations Additional Features ■ Patents pending Applications High Density Circuit Board Applications: ■ Hard disk drives ■ PC motherboards ■ PC peripherals ■ Point-of-sale (POS) equipment ■ PCMCIA cards Note: • MF-MSMD models can be wave soldered and reworked. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Recommended Pad Layout 3.2 ± 0.1 (0.126 ± .004) 2.70 ± 0.1 (.106 ± .004) 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) MM (INCHES) UNIT = Terminal material: solder-plated copper Termination pad solderability: Meets EIA Specification RS-186-9E, ANSI/J-STD-002 Category 3. |
Similar Part No. - MF-MSMD200 |
|
Similar Description - MF-MSMD200 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |