5

SY58016L

Micrel

MICREL, INC.

1849 FORTUNE DRIVE

SAN JOSE, CA 95131

USA

TEL

This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or

other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc.

© 2002 Micrel, Incorporated.

16 LEAD

MicroLeadFrame™ (MLF-16)

3.00BSC

2.75BSC

0.50 DIA

3.00BSC

12

° max

SEATING

PLANE

2.75BSC

16

1

1

2

3

4

N

2

3

4

0.85

+0.15

–0.65

0.65

+0.15

–0.65

0.01

+0.04

–0.01

0.23

+0.07

–0.05

0.01

+0.04

–0.01

0.42

+0.18

–0.18

0.42

+0.18

–0.18

0.23

+0.07

–0.05

1.60

+0.10

–0.10

PIN 1 ID

0.5 BSC

1.5 REF

0.42

+0.18

–0.18

1.60

+0.10

–0.10

0.40

+0.05

–0.05

0.20 REF.

0.5BSC

SECTION "C-C"

SCALE: NONE

TOP VIEW

BOTTOM VIEW

1. DIMENSIONS ARE IN mm.

2. DIE THICKNESS ALLOWABLE IS 0.305mm MAX.

3. PACKAGE WARPAGE MAX 0.05mm.

4. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED

BETWEEN 0.20mm AND 0.25mm FROM TIP.

5. APPLIES ONLY FOR TERMINALS

CC

CL

4

Rev. 02

Package Notes:

1.

Package meets Level 2 Moisture Sensitivity Classification and is shipped in Dry-pack form.

2.

Expose pad must be soldered to a ground for proper thermal management.