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BCX56 Datasheet(PDF) 6 Page - NXP Semiconductors |
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BCX56 Datasheet(HTML) 6 Page - NXP Semiconductors |
6 / 8 page BC635_BCP54_BCX54_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 4 June 2007 6 of 15 NXP Semiconductors BC635; BCP54; BCX54 45 V, 1 A NPN medium power transistors 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air BC635 [1] - - 150 K/W BCP54 [1] - - 195 K/W [2] - - 130 K/W BCX54 [1] - - 250 K/W [2] - - 145 K/W [3] - - 100 K/W Rth(j-sp) thermal resistance from junction to solder point BC635 - - 40 K/W BCP54 - - 17 K/W BCX54 - - 30 K/W FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT54; typical values 006aaa088 10−5 10 10−2 10−4 102 10−1 tp (s) 10−3 103 1 102 10 103 Zth(j-a) (K/W) 1 0 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 |
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