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BD330 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BD330 Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 8 page 1999 Apr 26 4 Philips Semiconductors Product specification PNP power transistor BD330 PACKAGE OUTLINE UNIT bp cD E e1 LQ w REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.88 0.65 2.7 2.3 0.60 0.45 11.1 10.5 7.8 7.2 2.29 e 4.58 0.254 P 3.2 3.0 P1 3.9 3.6 DIMENSIONS (mm are the original dimensions) Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. 16.5 15.3 1.5 0.9 L1(1) max 2.54 SOT32 TO-126 97-03-04 0 2.5 5 mm scale A Plastic single-ended leaded (through hole) package; mountable to heatsink, 1 mounting hole; 3 leads SOT32 D P1 P E e1 A L Q c bp 12 3 L1 w M e |
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Similar Description - BD330 |
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