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BD829 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BD829 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 8 page 1998 May 29 3 Philips Semiconductors Product specification NPN power transistors BD825; BD829 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter BD825 − 45 V BD829 − 100 V VCEO collector-emitter voltage open base BD825 − 45 V BD829 − 80 V VEBO emitter-base voltage open collector − 5V IC collector current (DC) − 1A ICM peak collector current − 1.5 A IBM peak base current − 500 mA Ptot total power dissipation Tamb ≤ 25 °C − 2W Tmb ≤ 50 °C − 8W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air 62.5 K/W Rth j-mb thermal resistance from junction to mounting base 12.5 K/W |
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