Analog Switches

10

______________________________________________________________________________________

PROPRIETARY INFORMATION

TITLE:

APPROVAL

DOCUMENT CONTROL NO.

REV.

2

1

PACKAGE OUTLINE, 6, 8 & 10L,

TDFN, EXPOSED PAD, 3x3x0.80 mm

21-0137

D

L

C

L

C

SEMICONDUCTOR

DALLAS

A2

A

PIN 1

INDEX

AREA

D

E

A1

D2

b

E2

[(N/2)-1] x e

REF.

e

k

1

N

1

L

e

L

A

L

PIN 1 ID

C0.35

DETAIL A

e

NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY

DOCUMENT CONTROL NO.

APPROVAL

TITLE:

PROPRIETARY INFORMATION

REV.

2

2

COMMON DIMENSIONS

SYMBOL

MIN.

MAX.

A

0.70

0.80

D

2.90

3.10

E

2.90

3.10

A1

0.00

0.05

L

0.20

0.40

PKG. CODE

6

N

T633-1

1.50±0.10

D2

2.30±0.10

E2

0.95 BSC

e

MO229 / WEEA

JEDEC SPEC

0.40±0.05

b

1.90 REF

[(N/2)-1] x e

1.50±0.10

MO229 / WEEC

1.95 REF

0.30±0.05

0.65 BSC

2.30±0.10

T833-1

8

PACKAGE VARIATIONS

21-0137

0.25±0.05

2.00 REF

MO229 / WEED-3

0.50 BSC

1.50±0.10

2.30±0.10

10

T1033-1

0.25 MIN.

k

A2

0.20 REF.

D

SEMICONDUCTOR

DALLAS

PACKAGE OUTLINE, 6, 8 & 10L,

TDFN, EXPOSED PAD, 3x3x0.80 mm

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information

go to

www.maxim-ic.com/packages.)