AT1512

Preliminary product Information

FET BIAS CONTROLLER AND TONE DETECTION

2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C.

Tel: 886-3-563-0878

Fax: 886-3-563-0879

2005/10/19 REV:1.0

11

Reflow Profiles

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Profile Feature

Large Body

Pkg. thickness

≥2.5mm or Pkg.

volume

Small Body

Pkg. thickness

<2.5mm or Pkg.

volume <350mm

3

Large Body

Pkg. thickness

≥2.5mm or Pkg.

volume

Small Body

Pkg. thickness

≥2.5mm or Pkg.

volume

Average ramp-up rate

(TL to TP)

3

°C/second max.

3

°C/second max.

Preheat

-Temperature Min(Tsmin)

-Temperature Max (Tsmax)

-Time (min to max)(ts)

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

Tsmax to TL

-Ramp-up Rate

3

°C/second max.

Time maintained above:

-Temperature (TL)

-Time (tL)

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak Temperature(TP)

225+0/-5

°C

240+0/-5

°C

245+0/-5

°C

250+0/-5

°C

Time within 5

°C of actual Peak

Temperature (tP)

10-30 seconds

10-30 seconds

10-30 seconds

20-40 seconds

Ramp-down Rate

6

°C/second max.

3

°C/second max.

Time 25

°C to Peak Temperature

6 minutes max.

8 minutes max.

*All temperatures refer to topside of the package, measured on the package body surface.