1999-09-22

Page 2

Preliminary data

BSO 315 C

Termal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Dynamic Characteristics

Thermal resistance, junction - soldering point

(Pin 5, 6, 7, 8)

N

P

-

-

-

-

40

40

K/W

SMD version, device on PCB:

@ min. footprint; t

≤ 10 sec.

≤ 10 sec.

@ min. footprint; t

≤ 10 sec.

≤ 10 sec.

N

N

P

P

-

-

-

-

-

-

-

-

100

62.5

70

62.5

Static Characteristics, at

Drain- source breakdown voltage

N

P

30

-30

-

-

-

-

V

Gate threshold voltage,

N

P

1.2

-1

1.6

-1.5

2

-2.0

Zero gate voltage drain current

N

N

P

P

-

-

-

-

0.1

10

-0.1

-10

1

100

-1

-100

µA

Gate-source leakage current

N

P

-

-

10

-10

100

-100

nA

Drain-Source on-state resistance

N

P

-

-

0.1

0.2

0.15

0.4

Ω

Drain-Source on-state resistance

N

P

-

-

0.06

0.13

0.11

0.25

Ω

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.