HY62LF16804B-DFC datasheet(9/10 Pages) HYNIX

Part #	HY62LF16804B-DFC

Description	512Kx16bit full CMOS SRAM

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Manufacturer	HYNIX [Hynix Semiconductor]

Direct Link	http://www.skhynix.com/kor/main.do

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9 / 10 page

HY62LF16804B Series

Rev.00/May. 2001

8

PACKAGE INFORMATION

48ball Fine Pitch Ball Grid Array Package (F)

BOTTOM VIEW

TOP VIEW

B

A

A1 CORNER

INDEX AREA

6

5

4

3

2

1

A

B

C

D

C

C1

E

F

G

C1/2

H

B1/2

B1

SIDE VIEW

5

E1

E2

C

E

SEATING PLANE

4

A

r

3 D(DIAMETER)

Symbol

Min.

Typ.

Max.

A

-

0.75

-

B

-

3.75

-

B1

5.9

6.0

6.1

C

-

5.25

-

C1

8.4

8.5

8.6

D

0.3

0.35

0.4

E

0.9

1.0

1.10

E1

-

0.76

-

E2

0.20

0.25

0.30

r

-

0.08

Note

1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.

2. ALL DIMENSIONS ARE MILLIMETERS.

3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER

BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.

4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE

CROWN OF THE SOLDER BALLS.

5. THIS IS A CONTROLLING DIMENSION.

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HY62LF16804B-DFC Datasheet(PDF) 9 Page - Hynix Semiconductor

HY62LF16804B-DFC Datasheet(HTML) 9 Page - Hynix Semiconductor

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