HY62UF16800B

Rev.02/Apr. 2002

2

ORDERING INFORMATION

Part No.

Speed

Power

Package

Temp.

HY62UF16800B-DFC

55/70/85

LL-part

FBGA

C

HY62UF16800B-DFI

55/70/85

LL-part

FBGA

I

Note 1. C : Commercial, I : Industrial

ABSOLUTE MAXIMUM RATINGS (1)

Symbol

Parameter

Rating

Unit

Remark

Input/Output Voltage

-0.3 to Vcc+0.3

V

Vcc

Power Supply

-0.3 to 4.6

V

0 to 70

°C

HY62UF16800B-C

Operating Temperature

-40 to 85

°C

HY62UF16800B-I

Storage Temperature

-55 to 150

°C

Power Dissipation

1.0

W

Ball Soldering Temperature & Time

260

• 10

°C • sec

Note

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent

damage to the device. This is stress rating only and the functional operation of the device under these or

any other conditions above those indicated in the operation of this specification is not implied.

Exposure to the absolute maximum rating conditions for extended period may affect reliability.

TRUTH TABLE

I/O Pin

/CS1

CS2

/WE

/OE

/LB

/UB

Mode

I/O1~I/O8

I/O9~I/O16

Power

H

X

X

X

X

X

Hi-Z

Hi-Z

X

L

X

X

X

X

Hi-Z

Hi-Z

X

X

X

X

H

H

Deselected

Hi-Z

Hi-Z

Standby

L

H

H

H

L

X

Hi-Z

Hi-Z

L

H

H

H

X

L

Output Disabled

Hi-Z

Hi-Z

Active

L

H

Hi-Z

H

L

Hi-Z

L

H

H

L

L

L

Read

Active

L

H

Hi-Z

H

L

Hi-Z

L

H

L

X

L

L

Write

Active

Note:

2. UB, LB(Upper, Lower Byte enable)

These active LOW inputs allow individual bytes to be written or read.

When /LB is LOW, data is written or read to the lower byte, I/O1 -I/O8.

When /UB is LOW, data is written or read to the upper byte, I/O9 -I/O16.