HY62UF16806A-SMC datasheet(10/11 Pages) HYNIX

Part #	HY62UF16806A-SMC

Description	512Kx16bit full CMOS SRAM

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Manufacturer	HYNIX [Hynix Semiconductor]

Direct Link	http://www.skhynix.com/kor/main.do

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10 / 11 page

HY62UF16806A

Rev.03/Mar. 2002

9

PACKAGE INFORMATION

48ball Micro Ball Grid Array Package(M)

BOTTOM VIEW

TOP VIEW

B

A

A1 CORNER

INDEX AREA

6

5

4

3

2

1

A

B

C

D

C

C1

E

3.0 X 5.0 MIN

F

FLAT AREA

G

C1/2

H

B1/2

B1

SIDE VIEW

5

E1

E2

C

E

SEATING PLANE

4

A

r

3 D(DIAMETER)

Symbol

Min.

Typ.

Max.

A

-

0.75

-

B

-

3.75

-

B1

-

7.4

-

C

-

5.25

-

C1

-

8.5

-

D

0.3

0.35

0.4

E

0.85

0.9

0.95

E1

0.6

0.65

0.7

E2

0.2

0.25

0.3

r

-

0.08

Note

1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.

2. ALL DIMENSIONS ARE MILLIMETERS.

3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER

BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.

4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE

CROWN OF THE SOLDER BALLS.

5. THIS IS A CONTROLLING DIMENSION.

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HY62UF16806A-SMC Datasheet(PDF) 10 Page - Hynix Semiconductor

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