Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

February 2004

AH31

High Dynamic Range IF Amplifier

Product Information

Outline Drawing

Land Pattern

Product Marking

The component will be marked with an “AH31”

designator with a four-digit alphanumeric lot code

on the top surface of the package. Tape and reel

specifications for this part is located on the website

in the “Application Notes” section.

ESD / MSL Information

ESD Classification: Class 1B

Value:

Passes at 600 V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Classification: Class IV

Value:

Passes at 1000 V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating:

Level 3 at +225

°C convection reflow

Standard:

JEDEC Standard J-STD-020A

Mounting Configuration Notes

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80/.0135”) diameter drill and have a final plated

thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.