Specifications and information are subject to change without notice

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

Page 5 of 5

April 2006

ECP050D

½ Watt, High Linearity InGaP HBT Amplifier

Product Information

ECP050D-G Mechanical Information

This package is lead-free/RoHS-compliant. It is compatible with both lead-free (maximum 260

qC reflow temperature) and leaded

(maximum 245

qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

qC

62

qC / W

162

qC

Notes:

1. The thermal resistance is referenced from the junction-to-case at a case

temperature of 85 C. Tjc is a function of the voltage at pins 10 and 11 and

the current applied to pins 10, 11, and 16 and can be calculated by:

Tj = Tcase + Rth * Vcc * Icc

2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85

C case temperature. A minimum MTTF of 1 million hours is achieved for

junction temperatures below 247 C.

Product Marking

The component will be marked with an

“E050G” designator with an alphanumeric lot

code on the top surface of the package. The

obsolete tin-lead package is marked with an

“E050”

designator

followed

by

an

alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes between 500 and 1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 1 at +260 C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1.

A heatsink underneath the area of the PCB for the mounted

device is recommended for proper thermal operation.

2.

Ground / thermal vias are critical for the proper performance

of this device. Vias should use a .35mm (#80 / .0135” )

diameter drill and have a final plated thru diameter of .25

mm (.010” ).

3.

Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

4.

Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

5.

Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

6.

RF trace width depends upon the PC board material and

construction.

7.

Use 1 oz. Copper minimum.

8.

All dimensions are in millimeters (inches). Angles are in

degrees.

MTTF vs. GND Tab Temperature

100

1000

10000

100000

1000000

50

60

70

80

90

100

Tab Temperature (°C )