4

SY88843V

Micrel, Inc.

M9999-110905

hbwhelp@micrel.com or (408) 955-1690

Supply Voltage (V

EN, SDLVL Voltage ................................................ 0 to V

CC

REF Current ...............................................................

±1mA

SD Current .................................................................

±5mA

DOUT, /DOUT Current .............................................

±25mA

DIN, /DIN Current .....................................................

±10mA

Storage Temperature (T

Lead Temperature (Soldering, 20 sec.) .................... 260

°C

Supply Voltage (V

............................................................ +4.5V to +5.5V

Ambient Temperature (T

Junction Temperature (T

MLF™

θ

ψ

EPAD-MSOP

θ

ψ

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

I

CC

Power Supply Current

3.3V, Note 4

28

42

mA

5V, Note 4

30

45

mA

Power Supply Current

3.3V, Note 5

45

62

mA

5V, Note 5

47

65

mA

V

REF

REF Voltage

V

V

SDLVL

SDLVL Voltage Range

V

REF

V

CC

V

V

OH

DOUT, /DOUT HIGH Voltage

Note 6

V

V

V

CC

V

V

OL

DOUT, /DOUT LOW Voltage

3.3V, Note 6

V

V

V

V

5V, Note 6

V

V

V

V

V

OFFSET

Differential Output Offset

Note 6

±80

mV

Z

O

Single-Ended Output Impedance

40

50

60

Ω

Z

I

Single-Ended Input Impedance

40

50

60

Ω

DC ELECTRICAL CHARACTERISTICS

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

OH

SD Output HIGH Level

Sourcing 100

µA

2.4

V

CC

V

V

OL

SD Output LOW Level

Sinking 2mA

0.5

V

V

IH

EN Input HIGH Voltage

2.0

V

V

IL

EN Input LOW Voltage

0.8

V

I

IH

EN Input HIGH Current

V

20

µA

V

100

µA

I

IL

EN Input LOW Current

V

–0.3

mA

Notes:

1. Permanent device damage may occur if Absolute Maximum Ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to Absolute Maximum Rating conditions for extended

periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Thermal performance assumes the use of 4-layer PCB. Exposed pad must be soldered (or equivalent) to the device’s most negative potential on the

PCB.

4. Excludes current of CML output stage. See “Detailed Description.”

5. Total device current with no output load.

6. Output levels are based on a 50

Ω to V

mode.

TTL DC ELECTRICAL CHARACTERISTICS