Advance Product Information

October 20, 2004

9

Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process

specifications. Specifications are subject to change without notice.

TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com

Assembly of a TGA2514-EPU-FL Surface Mount Package onto a Motherboard

1. Clean the motherboard or module with acetone. Rinse with alcohol and DI water. Allow the circuit

to fully dry.

2. To improve the thermal and RF performance, we recommend a heat sink attached to the bottom of the package

and apply SnPb or equivalent solder to the bottom of TGA2514.

3. Apply SnPb or equivalent solder to each pin of TGA2514 and to the backside of the package.

4 Clean the assembly with alcohol.

.

Ordering Information

Part

Package Style

TGA2514-EPU-FL

Flange (package bolted down)

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

TGA2514-EPU-FL