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BGY122B Datasheet(PDF) 10 Page - NXP Semiconductors |
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BGY122B Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 16 page  1998 May 11 10 Philips Semiconductors Product specification UHF amplifier modules BGY122A; BGY122B SOLDERING The indicated temperatures are those at the solder interfaces. Advised solder types are types with a liquidus less than or equal to 210 °C. Solder dots or solder prints must be large enough to wet the contact areas. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitted. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. The maximum allowed temperature is 250 °C for a maximum of 5 seconds. The maximum ramp-up is 10 °C per second. The maximum cool-down is 5 °C per second. Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. Fig.19 Recommended reflow temperature profile. handbook, halfpage 0 300 200 100 0 15 23 4 MGM159 t (min) T ( °C) |
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