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S29CD016J0MDGH117 Datasheet(PDF) 11 Page - SPANSION

Part # S29CD016J0MDGH117
Description  16 Megabit (512k x 32-Bit) CMOS 2.6 or 3.3 Volt-only Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
Logo SPANSION - SPANSION

S29CD016J0MDGH117 Datasheet(HTML) 11 Page - SPANSION

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September 20, 2006 Revision A2
S29CD016J/S29CL016J Known Good Die
11
Supplement
(Adv an ce
Inf o r m atio n)
Figure 6.1 Spansion KGD Product Test Flow
Electronic marking is programmed into every KGD for the purpose of traceability. The electronic marking
contains wafer lot number, wafer number of origin, die location on the wafer, mask revision, test program
revision, test dates, and speed grade. Figure 6.1 illustrates the steps where specific electronic marking
information is programmed. For more information regarding electronic marking, reference the S29CD016J
Electronic Marking Data Sheet Supplement.
Wafer Sort 1
Bake
24 hours at 250°C
Wafer Sort 2
Wafer Sort 3
High Temperature
Packaging for
Shipment
Shipment
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
Data Retention
DC Parameters
Functionality
Programmability
Erasability
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Electronic Marking
Step 1: Wafer sort,
test 1 & 2 information
Electronic Marking
Step 2: Final class or
KGD test information
& device speed


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