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S71AL016D02BFWTF3 Datasheet(PDF) 10 Page - SPANSION |
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S71AL016D02BFWTF3 Datasheet(HTML) 10 Page - SPANSION |
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10 / 76 page  10 S71AL016D_02_04_00_A1 November 11, 2004 Pr e l i m i n a r y Physical Dimensions TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package 3348 \ 16-038.22a PACKAGE TLC 056 JEDEC N/A D x E 9.00 mm x 7.00 mm PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.20 PROFILE A1 0.20 --- --- BALL HEIGHT A2 0.81 --- 0.97 BODY THICKNESS D 9.00 BSC. BODY SIZE E 7.00 BSC. BODY SIZE D1 5.60 BSC. MATRIX FOOTPRINT E1 5.60 BSC. MATRIX FOOTPRINT MD 8 MATRIX SIZE D DIRECTION ME 8 MATRIX SIZE E DIRECTION n 56 BALL COUNT φb 0.35 0.40 0.45 BALL DIAMETER eE 0.80 BSC. BALL PITCH eD 0.80 BSC BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT A1,A8,D4,D5,E4,E5,H1,H8 DEPOPULATED SOLDER BALLS NOTES: 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. N/A 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. E1 7 SE A D1 eD DC E F G H 8 7 6 4 3 2 1 eE 5 B PIN A1 CORNER 7 SD BOTTOM VIEW C 0.08 0.20 C A E B C 0.15 (2X) C D C 0.15 (2X) INDEX MARK 10 6 b TOP VIEW SIDE VIEW CORNER 56X A1 A2 A 0.15 M M C C AB 0.08 PIN A1 |
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