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TDA4865J Datasheet(PDF) 14 Page - NXP Semiconductors |
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TDA4865J Datasheet(HTML) 14 Page - NXP Semiconductors |
14 / 18 page TDA4865J_TDA4865AJ_2 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 02 — 3 November 2006 14 of 18 NXP Semiconductors TDA4865J; TDA4865AJ Vertical deflection booster 13. Package outline Fig 12. Package outline SOT524-1 (DBS7P) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. SOT524-1 0 10 mm 5 scale w M bp Dh q1 Z 17 e e1 m e2 x A2 non-concave D1 D P k q2 L3 L2 L Qc E 00-07-03 03-03-12 DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad SOT524-1 view B: mounting base side B UNIT bp L1 cD(1) Dh Lq2 mm 2.7 2.3 A2 (2) 0.80 0.65 0.58 0.48 13.2 12.8 D1 (2) 6.2 5.8 3.5 Eh 3.5 e 2.54 e1 1.27 e2 5.08 4.85 Q E(1) 14.7 14.3 Z(1) 2.92 2.37 11.4 10.0 L2 6.7 5.5 L3 4.5 3.7 3.4 3.1 1.15 0.85 q 17.5 16.3 q1 2.8 m 0.8 v 3.8 3.6 3 2 12.4 11.0 P k 0.02 x 0.3 w Eh L1 q v M |
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