TDA4865J_TDA4865AJ_2

© NXP B.V. 2006. All rights reserved.

Product data sheet

Rev. 02 — 3 November 2006

14 of 18

NXP Semiconductors

TDA4865J; TDA4865AJ

Vertical deflection booster

13. Package outline

Fig 12. Package outline SOT524-1 (DBS7P)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

SOT524-1

0

10 mm

5

scale

bp

Dh

q1

Z

17

e

e1

m

e2

x

A2

non-concave

D1

D

P

k

q2

L3

L2

L

Qc

E

00-07-03

03-03-12

DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad

SOT524-1

view B: mounting base side

B

UNIT

bp

L1

Dh

Lq2

mm

2.7

2.3

A2

(2)

0.80

0.65

0.58

0.48

13.2

12.8

D1

(2)

6.2

5.8

3.5

Eh

3.5

e

2.54

e1

1.27

e2

5.08

4.85

Q

14.7

14.3

2.92

2.37

11.4

10.0

L2

6.7

5.5

L3

4.5

3.7

3.4

3.1

1.15

0.85

q

17.5

16.3

q1

2.8

m

0.8

v

3.8

3.6

3

2

12.4

11.0

P

k

0.02

x

0.3

w

Eh

L1

q