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S75WS256NDFBAWPA Datasheet(PDF) 3 Page - SPANSION |
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S75WS256NDFBAWPA Datasheet(HTML) 3 Page - SPANSION |
3 / 216 page Publication Number S75WS-N-00 Revision A Amendment 0 Issue Date February 17, 2005 General Description The S75WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items: One or more S29WSxxxN code Flash CellularRAM One or more S29RS-N data storage Flash The products covered by this document are listed in the table below: Distinctive Characteristics MCP Features Power supply voltage of 1.7 V to 1.95 V High Performance — 54 MHz, 66 MHz Packages —9 x 12 mm 84 ball FBGA Operating Temperature — Wireless, –25°C to +85°C S75WS256Nxx Based MCPs Stacked Multi-Chip Product (MCP) 256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with 128 Mb (8M x 16-Bit) CellularRAM and 512 Mb (32M x 16-bit) Data Storage Data Sheet PRELIMINARY Device Code Flash Density RAM Density Data Storage Flash Density 256 Mb 128 Mb 512 Mb S75WS256NDF |
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