S75WS-P_00_02 September 6, 2006

S75WS-P based MCP/POP Products

5

Da t a

Sh ee t

( A dv an c e

In f o r m at io n)

4.2

9 x 12 mm, 115-ball MCP

4.3

Special Handling Instructions For FBGA Package

Special handling is required for Flash Memory products in FBGA packages.

Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The

package and/or data integrity may be compromised if the package body is exposed to temperatures above

150×C for prolonged periods of time.

3

29

10

5

47

6

8

1

NC

NC

NC

NC

B

D

E

F

G

H

J

K

L

M

N

P

A

C

NC

NC

NC

NC

AVD#

IO12

NC

F-WP#

N-RY/

BY#

IO11

IO10

A3

N-RE#

A15

IO9

A2

N-CE#

A21

IO8

A1

N-VCC

A22

N-VCC

A0

N-VSS

A16

N-VSS

F1-CE#

N-CLE#

R-MRS

IO7

R-CE#

N-ALE#

VSS

IO6

N-WP#

N-WE#

IO4

IO5

RFU

NC

IO3

PRE

NC

NC

NC

NC

NC

NC

NC

NC

Legend

No Connect

NOR Flash Only

Reserved for Future Use

pSRAM Only

NAND Flash Only

NOR Flash/

pSRAM Shared Only

VSS

CLK

A7

R-LB#

A6

R-UB#

A5

A18

A4

A17

VSS

DQ1

OE#

DQ9

DQ0

DQ10

DQ8

DQ2

RFU

VSS

RFU

IO15

F-ACC

WE#

F-RST#

RFU

RDY

A20

RFU

A23

RFU

RFU

DQ3

DQ4

F-VCC

R-VCC

DQ11

RFU

F-VCC

IO0

IO14

IO13

A8

A11

A19

A12

A9

A13

A10

A14

DQ6

RFU

DQ13

DQ15

DQ12

DQ7

DQ5

DQ14

IO1

IO2