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S75WS256NEGBFWSH2 Datasheet(PDF) 7 Page - SPANSION |
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S75WS256NEGBFWSH2 Datasheet(HTML) 7 Page - SPANSION |
7 / 10 page S73WS-P_00_A0 March 16, 2006 S73WS-P based MCP Products 5 Dat a Sheet ( A dv anc e I n f o r m a t i on ) 4. Ordering Information The order number is formed by a valid combinations of the following: S73WS 512 P D0 HF 6 4 V 0 PACKING TYPE 0 = Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER 2 V = 66MHz/104MHz Speed MODEL NUMBER 1 4 = SDR DRAM x16, Type 5 PACKAGE DESCRIPTOR Depends on Character 12. For a more detailed description see Table 4.1. PACKAGE TYPE & MATERIAL SET HF = 1.2mm MCP FBGA, Pb-free KF = 1.2mm POP FBGA, Pb-free JF = 1.4mm MCP FBGA, Pb-free DRAM & ORNAND FLASH DENSITY D0 = 128 Mb DRAM, No Data Flash PROCESS TECHNOLOGY P = 90 nm, MirrorBit TM Technology CODE FLASH DENSITY 512 = 512Mb PRODUCT FAMILY S73WS Stacked Products (MCP) 1.8 V NOR Flash and Mobile DRAM Table 4.1 Character Position Descriptions (Sheet 1 of 2) Character 12 Character 13 Character 14 Description Package Area Package Ball Count Raw Ball Size H, J, or G 07x9 mm 56 0.35 mm 17x9 mm 80 2 8x11.6 mm 64 3 8x11.6 mm 84 4 9x12 mm 84 5 9x12 mm 115 6 9x12 mm 137 7 11x13 mm 84 8 11x13 mm 115 9 11x13 mm 137 |
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